Amod evaporator

The Angstrom Sputter System is a load locked sputtering deposition system for R&D applications. It can be used to deposit thin metal or dielectric films from three MAK 3” sputter targets powered by two 1000W RF and one 1000W DC power supplies. The MAK guns are also capable of sputtering magnetic materials.

Process gases: 
Ar, N2, O2

Sputter targets and processes:
Aluminum
Carbon
Chromium
Cobalt
Copper
Gold*
Iron
Nickel
Nickel Oxide (reactive)
Permalloy (80%/20%)
Silicon (undoped or doped)
Silicon Nitride (reactive)
Silicon Dioxide
Titanium
Zirconium

*Additional usage fees exist for precious metal targets.

At this time other targets available from MMF users are Indium Tin Oxide and Nickel.

Prior Research

Processes

Recipes