Montana State University
Academics | Administration | Admissions | A-Z Index | Directories

Montana State Universityspacer Mountains and Minds
MSU AcademicsspacerMSU AdministrationspacerMSU AdmissionsspacerMSU A-Z IndexspacerMSU Directoriesspacer
Montana Microfabrication Facility
Processes
Process Type: Deposition
Process Description
Thermal Oxidation
Chrome thin film

Chrome RF sputter deposition.

dep rate= 9.4nm/min, power=400W RF, pressure=10mT Argon, substrate height =120

Gold thin film

Thin films of gold can be deposited via sputtering or evaporation. Ebeam and resistive thermal evaporation are available.

Process Type: Etching
Process Description
Cryogenic etch

Low temperature silicon etch for high aspect ratio features

Process Type: Lithography
Process Description
Shipley SPR 1813 exposure

Resist exposure time

HMDS coating

Load wafers in YES LP-III vapor prime oven and press start

Process Type: Miscellaneous
Process Description
Step Height

Measurement of step height from 50A to 400um

View Text-only Version Text-only
© Montana State University 2008 Didn't Find it? Please use our contact list or our site index.